PERMABOND® 919 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMABOND 919 will cure to fixture strength in 10 seconds on most surfaces, and rapidly develops high strength with full cure obtained in 24 hours. The adhesive was specifically designed to meet the high temperature resistance required by certain applications. It provides excellent bond strength to steel, aluminum, and most metal surfaces. The cyanoacrylate will also adhere well to a wide variety of other materials including most types of plastic and rubber.
In order to withstand high temperature environments, PERMABOND 919 was designed with a secondary curing mechanism that is activated at temperatures higher than 150°C (302°F). The procedure to activate this mechanism is as follows:
- Parts are bonded and clamped at room temperature for four
- The clamped parts are then heated at 150°C (302°F) for two hours.
- After the two hours, the bond will be thermally resistant up to 250°C (482°).
FEATURES AND BENEFITS
- Rapid development of high strength
- Ease of use – no mixing or heat cure
- Bonds most materials
- 100% reactive, no solvents
Physical Properties of Uncured Adhesive
Chemical composition | Allyl cyanoacrylate |
Appearance | Colourless |
Viscosity @ 25°C | 2-6 mPa.s (cP) |
Specific gravity | 1.1 |
Typical Curing Properties
Maximum gap fill | 0.05 mm 0.002 in |
Fixture / handling time* (0.3 N/mm² shear strength is achieved) | <20 seconds (Steel) <15 seconds (NBR Rubber) <20 seconds (Buna N Rubber) <20 seconds (Phenolic) |
Full strength | 24 hours |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 20-22 N/mm² (2900-3200 psi) Aluminium 16-18 N/mm² (2300-2600 psi) ABS 4 N/mm² (600psi) Polystyrene 3.5 N/mm² (500psi) PC 7 N/mm² (1000psi) Phenolic 14N/mm² (2000psi) Gum rubber 2N/mm² (300psi) Valox 4N/mm² (600psi) |
Impact Strength (ASTM D-950) | 3-5 kJ/m² (1.4-2.4 ft-lb/in²) |
Hardness (ISO868) | 85 Shore D |
Coefficient of thermal expansion | 90 x 10-6 mm/mm/°C |
Coefficient of thermal conductivity | 0.1 W/(m.K) |
