MXBON 21441 1K Cyanoacrylate Adhesive Transparent, Yellow is a low viscosity light-curing cyanoacrylate adhesive. This advanced formulation is engineered for bonding applications that require very rapid fixture, fillet cure, or surface cure. Its unique UV and visible light cure properties facilitate rapid curing of exposed surface areas. This makes it an exceptional product for high-speed industrial assembly processes, ensuring efficiency and reliability in demanding production environments.
General Information of MXBON 21441 Cyanoacrylate Adhesive
MXBON 21441 Cyanoacrylate Adhesive utilizes ethyl cyanoacrylate chemistry, enhanced with a photoinitiator. This robust, one-part system requires no mixing, significantly simplifying application processes. It presents as a transparent, yellow liquid in its uncured state. The primary cure mechanism relies on ultraviolet (UV) light exposure. Additionally, ambient humidity provides a crucial secondary cure. This dual-cure capability ensures comprehensive bonding and enhances reliability across diverse environmental conditions. The MXBON 21441 Cyanoacrylate Adhesive is ideal for precise, controlled applications where speed and strength are paramount.
Key Features of MXBON 21441
- Rapid Light Cure: Achieve tack-free surfaces in under 10 seconds with UV/Visible light exposure. This dramatically accelerates production cycles.
- Low Viscosity: Ensures excellent flow and penetration into extremely tight bond gaps, optimizing adhesive distribution and bond line thickness.
- One-Part System: Eliminates the need for pre-mixing, streamlining application and reducing potential errors and material waste.
- Dual Cure Mechanism: Benefits from both UV/Visible light and ambient humidity for robust, reliable bonding, even in shadowed areas.
- Versatile Substrate Adhesion: Bonds effectively to various materials including ABS, Acrylic, PC, and PVC, offering broad utility.
Typical Industrial Applications of MXBON 21441
This formulation is engineered for the following applications:
- High-speed assembly requiring rapid fixture and immediate handling of components.
- Bonding applications needing quick fillet cure for aesthetic and structural integrity.
- Surface curing for enhanced finish, protection, and improved tactile properties on various parts.
- Precision bonding in electronics manufacturing, including small component attachment.
- Assembly of consumer goods where fast processing and strong bonds are essential.
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| 参数项目 | 数值 / 特性 |
|---|---|
| 技术类型 (Technology) | 氰基丙烯酸酯 / 紫外光 / 可见光 |
| 化学成分 (Chemistry) | 氰基丙烯酸乙酯（含光引发剂） |
| 外观（未固化） | 透明黄色液体 |
| 组分 (Components) | 单组分 – 无需混合 |
| 粘度 @ 25 ℃ | 8 – 20 mPa·s |
| 比重 @ 25 ℃ | 1.13 g/cm³ |
| 主固化方式 (Primary Cure) | 紫外线 (UV) 照射 |
| 副固化方式 (Secondary Cure) | 环境湿度固化 |
| 消粘时间（UV/可见光） | < 10 秒 |
| 定位时间 (ABS 基材) | 15 秒 |
| 拉伸剪切强度 (ABS, 10秒 UV/Vis 固化) | 8.5 N/mm² |
| 最佳储存温度 | 2 ºC 至 8 ºC |
| 保质期 | 12 个月 |
