Multi-Cure 9001-E-V3.1

Multi-Cure 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.

Multi-Cure 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.

APPLICATIONS:

• Chip-on-board
• Chip-on-flex
• Chip-on glass
• Wire bonding
• Bare-die encapsulation