Light/Moisture-Cure Clear Encapsulant
Dual-Cure 9103 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. Dual-Cure 9103 encapsulating material is specially formulated to cure in shadowed areas over time with ambient moisture.
FEATURES:
- UV/Visible light cure
- Secondary moisture cure
- Flexible encapsulant
- Shadowed area performance
- Moisture and thermal resistance
APPLICATIONS:
- Chip on board
- Chip on flex
- Chip on glass
- Wire bonding
Uncured properties | ||
Property | Value | Test method |
Solvent content | No Nonreactive solvent | N/A |
Chemical class | Acrylated urethane | N/A |
Appearance | Translucent light straw liquid | N/A |
Soluble in | Organic solvents | N/A |
Density, g/ml | 1.09 | ASTM D1875 |
Viscosity, cP (20rpm) | 25,000 (nominal) | DSTM 502 |
Cured mechanical properties | ||
Property | Value | Test method |
Durometer hardness | D30-D50 | ASTM D2240 |
Tensile at break, MPa [psi] | 4.9 [718] | ASTM D638 |
Elongation at break, % | 36 | ASTM D638 |
Modulus of Elasticity, MPa [psi] | 17.6 [2,670] | ASTM D638 |
Other cured properties | ||
Property | Value | Test method |
Boiling water absorption, % (2h) | 0.4 | ASTM D570 |
Refractive index (20°C) | 1.50 | ASTM D542 |
Linear shrinkage, % | 2.0 | ASTM D2566 |