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Momentive TIA225GF Liquid-Dispensed Silicone Thermal Pad Prostech Vietnam

Momentive TIA225GF Liquid-Dispensed Silicone Thermal Pad

  • Product code: TIA225GF
  • Manufacturer:
  • Package size: 25 kg pail
  • Shelf Life:

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TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

FEATURES:

  • Good thermal conductivity
  • Fast low-temperature cure
  • Retains softness after cure to enhance stress relief during thermal cycling
  • Easy to use 1:1 mixing ratio
  • Conforms to complex shapes of three-dimensional interface designs
  • Can be dispensed or printed
  • Repairable
  • Flame retardant: UL94V-0 equivalent
Uncured PropertiesUnitTIA225GF(A)TIA225GF(B)
Appearance Dark GrayLight Gray
Viscosity (23°C)Pa.s100100
Mixing ratio (by weight) 100:100
Viscosity after mixing (23°C)hour100
Pot lifehour4

Cure condition (70°C)

(23°C)

hour

0.5

24

 

Cured Properties(†) (0.5h at 70°C) TIA225GF
Appearance Gray
Density (23°C)g/cm³2.90
Thermal conductivityW/(m·K)2.5
Thermal resistance (BLT: 50μm)mm²·K/W35
Hardness (Type E) 50
Tensile strengthMPa0.4
Elongation%70
Volume resistivityMΩ∙m6.0×10^6
Dielectric strengthkV/mm20

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