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Home > Products > By Application > Potting - Encapsulant > Silicone Potting > Momentive TIA222G 2K Thermally Conductive Silicone
Momentive SilCool XE13-C1862PT Silicone Thermal Adhesive Prostech Vietnam

Momentive TIA222G 2K Thermally Conductive Silicone

  • Product code: TIA222G
  • Manufacturer: Momentive
  • Package size: 1 kg/ 2 kg
  • Shelf Life:

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  • Description
  • Specification
  • TDS/MSDS
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TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat sinks. The flowability of TIA222G silicone allows it to conform to complex three-dimensional shapes and cavities in potting applications. TIA222G silicone quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.

FEATURES:

  • Good thermal conductivity
  • Fast cure with exposure to heat
  • Easy to use 1:1 mixing ratio by weight or volume
  • Flame Retardant: UL94 V-0 certified (File No. E56745)

APPLICATIONS:

  • Thermal Management
CriteriaUnitPart APart B
Color Dark GrayLight Gray
Mixing Ratio (by weight or volume) 100:100
Viscosity (23 °C) (after mixing)Pa.s20
Pot Lifeh20
Cure Condition (with heat)°C / h70/ 0.5
Cure Condition (room temperature)h24
Post-Cure Properties  
Density (23 °C)g/cm^32.81
Thermal ConductivityW/(m.K)2.2
Hardness (type E) 45
Volume ResistivityMΩ.m4.8×10^6
Dielectric Strength20kV/mm20
CTEppm/K140
Low Volatile Siloxane (D3 – D10)ppm<200

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    Momentive TIA222G 2K Thermally Conductive Silicone

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      Momentive TIA222G 2K Thermally Conductive Silicone

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        Momentive TIA222G 2K Thermally Conductive Silicone

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          Momentive TIA222G 2K Thermally Conductive Silicone

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