Momentive SilCool XE13-C1862PT Silicone Thermal Adhesive

XE13-C1862PT is a one-component, heat curable silicone adhesive designed for thermally conductive applications. The product cures quickly with heat and adheres well to a variety of substrates without the use of a primer.

FEATURES:

Excellent thermal conductivity
Low viscosity
Higher elongation than conventional products
Ready to use: one component
Heat accelerated cure
Excellent adhesive properties: Primerless adhesion to many types of substrates
Non-corrosive to metals

Property	Unit	Value
Appearance		Gray, flowable paste
Specific Gravity (23 °C)		2.87
Hardness (Type A)		64
Viscosity (23°C)	Pa•s	50
Tensile Strength	MPa	1.4
Elongation	%	80
Adhesion Strength	MPa	0.9
Dielectric Strength	kV/mm	20
Volume Resistivity	Ω·cm	5.0×10^14
Thermal Conductivity	W/m·K	2.5
Water adsorption	%	<0.6

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