Product Introduction
SILCOOL SDI5279 is a one-component, heat-curing silicone adhesive with high thermal conductivity, designed for advanced semiconductor thermal interface applications. Its thixotropic consistency supports stable dispensing, while its strong adhesion between silicon dies and Ni-plated copper makes it an excellent TIM1 material for large flip-chip BGA packages. SDI5279 provides robust reliability and efficient thermal transfer in high-density electronic designs.
Momentive SILCOOL SDI5279 Adhesive Features
- High thermal conductivity for efficient heat dissipation
- Thixotropic viscosity suitable for automated dispensing
- Strong adhesion to Si die and Ni-plated Cu
- Greater reliability compared to gel-type TIM materials
- One-component system with fast heat curing
- 24-hour pot life after thawing
- Available in syringe packaging
Momentive SILCOOL SDI5279 Adhesive Applications
- Thermal interface material (TIM1) for semiconductor packaging
- Flip-chip BGA thermal management
- Die-attach thermal bonding solutions
- High-performance electronic modules requiring durable thermal adhesion
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
|---|---|
| Appearance (Uncured) | Light Gray |
| Viscosity (23°C) | 130 Pa·s |
| Appearance (Cured) | Soft, gray adhesive |
| Density (23°C) | 3.2 g/cm³ |
| Hardness (Type A) | 75 |
| Elongation | 50% |
| Thermal Conductivity | 5.2 W/m·K |
| Storage Modulus (25°C) | 20 MPa |
| Pot Life | 24 hrs |
| Shelf Life | 9 months (-20°C to -40°C) |
| Recommended Cure | 125°C/30 min + 150°C/60 min |
