Low Temperature Solder Paste PF743 138℃

PF743 is made with the Sn-48Bi-Ag-y alloy that has been qualified by a third-party organization and has a melting point of 138°C. PQ10 in comparison with SnAgCu:

FEATURES:

Low-Temperature Solder Paste.
Shenmao Technology has developed a Low-Temperature Solder Paste for SMT devices.
The Low-Temperature Solder Paste has been qualified by third-party organizations.
Reduced peak reflow temperature
Reduced energy consumption
Reduced warpage of PCB and components
Solder Paste: Sn42Bi58
Melting point: 138℃
Finer bismuth phase
Better drop test performance
Better thermal cycle test performance

Alloy Composition	Sn-48Bi-Ag-y
Melting Temperature ( ° C)	137 – 155
Recommended Applying Method	Printing/ Dispensing
Application	SMT

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