- Low Pressure Molding (LPM)
- with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt, and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.
Low Pressure Molding (LPM)
with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt, and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.
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The key to this process is the raw materials and specialized molding equipment. Dimer acid-based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material when heated, becomes less viscous, and is able to be re-shaped, then hardens to keep the desired form upon cooling down. These polyamide materials differ from other thermoplastics in two main areas:
At processing temperature (410°F/210°C) the viscosity is very low, typically around 3,000 centipoises (similar to pancake syrup). Low viscosity materials require low injection pressure in order to inject into a cavity. In fact, it is normal to use a simple gear pump to inject the polyamide material. Low injection pressure is paramount when over-molding a relatively fragile electronic component.
Polyamide materials are basically high-performance hot-melt adhesives. The adhesive properties of polyamide are what seals a chosen substrate. The type of adhesion is purely mechanical i.e. no chemical reaction takes place.
FEATURES OF PROS TECHNOLOGY LOW PRESSURE MOLDING SOLUTIONS:
■ Simplified process, get the electronics over-mold process as an example:
– Step 1: Insert Electronics
– Step 2: Overmold by LPM Machines
– Step 3: Test
■ “Sky Lining” allows using of less material, precise encapsulation, and less weight
■ Complete watertight encapsulation
■ Safe, 1-component materials, UL 94-V0 approved
■ Zero waste
■ Cost – Saving
RECOMMENDED APPLICATIONS USING LOW PRESSURE MOLDING FOR HIGHER PERFORMANCE
■ Automotive Sensors
■ Engine Control Units
■ Lighting Display Boards
■ Power Regulators
■ Industrial Sensors
■ Medical Sensor
In each industry, the Low Pressure Molding System is different which depends on the productivity, manufacturing speed, the materials as well. In order to receive more recommendations and suitable solutions for your product line, please do not hesitate to contact us through: (+84) 984 695 398 or email: firstname.lastname@example.org