LOCTITE ECCOBOND EO-1072 is a high-performance, one-component epoxy encapsulant designed for robust electronic component protection. This advanced material delivers exceptional reliability and superior handling properties. It ensures long-term durability in demanding industrial environments.
General Information of LOCTITE ECCOBOND EO-1072
LOCTITE ECCOBOND EO-1072 utilizes advanced epoxy technology, presenting as a black, single-component formulation. This material is engineered for heat cure applications, simplifying processing for manufacturers. Its unique rheology allows it to function effectively as both a dam and a fill encapsulant. Consequently, it offers versatile application capabilities within a single product.
Engineered for precision, LOCTITE ECCOBOND EO-1072 ensures excellent handling properties during dispensing. It provides a reliable solution for casting compounds and other critical electronic protection needs. Furthermore, its robust chemical composition contributes to its high performance and extended shelf life, making it a preferred choice for sensitive electronic assemblies.
Key Features & Technical Benefits
- High Tg (Glass Transition Temperature): This material maintains structural integrity and performance across a wide temperature range. It ensures stability in high-heat operating conditions, preventing material degradation.
- Low Extractable Ionics: LOCTITE ECCOBOND EO-1072 minimizes ionic contamination. This protects sensitive electronic components from corrosion and electrical leakage, enhancing device longevity.
- High Performance: The encapsulant delivers superior protection and reliability. It withstands harsh environmental factors, ensuring consistent functionality of encapsulated devices.
- Good Shelf Life: Manufacturers benefit from extended storage stability. This reduces material waste and optimizes inventory management, contributing to cost efficiency.
- Fast Curing: Rapid heat curing accelerates production cycles. This feature boosts throughput and reduces manufacturing time, improving overall operational efficiency.
Typical Industrial Applications
This formulation is engineered for the following applications:
- Encapsulant – Dam
- Encapsulant – Fill
- Casting Compound
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
| Technology | Epoxy |
| Appearance | Black |
| Filler Weight | 50% |
| Components | One-component |
| Cure | Heat cure |
| Viscosity, Brookfield (Spindle 7, 2 rpm) @ 25°C | 100,000 mPa·s (cP) |
| Viscosity, Brookfield (Spindle 7, 20 rpm) @ 25°C | 80,000 mPa·s (cP) |
| Specific Gravity @ 25°C | 1.65 |
| Pot life @ 25°C | 30 days |
| Gel Time @ 121°C | 5 minutes |
| Gel Time @ 140°C | 3 minutes |
| Shelf Life @ 5°C | 183 days |
| Recommended Cure Schedule | 5 minutes @ 140 to 150°C |
| Glass Transition Temperature (Tg) | 135°C |
| Coefficient of Thermal Expansion (Below Tg) | 43 ppm/°C |
| Coefficient of Thermal Expansion (Above Tg) | 123 ppm/°C |
| Coefficient of Thermal Conductivity | 0.51 W/(m·K) |
| Flexural Modulus | 6,700 N/mm² |
| Flexural Strength | 60 N/mm² |
| Extractable Ionic Content, Chloride (Cl-) | 100 ppm |
| Extractable Ionic Content, Sodium (Na+) | 5 ppm |
| Water Absorption (96 hours @ 121°C, 100% RH) | 3.14% |
| Shore Hardness | ≥90 Shore D |
| Elongation | 0.9% |
| Linear Shrinkage (10 grams) | 0.84% |
| Dielectric Constant / Dissipation Factor (1 kHz) | 4.76 / 0.004 |
| Dielectric Constant / Dissipation Factor (10 kHz) | 4.74 / 0.0061 |
| Dielectric Constant / Dissipation Factor (100 kHz) | 4.7 / 0.0101 |
| Dielectric Constant / Dissipation Factor (1 MHz) | 4.63 / 0.0137 |
| Dielectric Constant / Dissipation Factor (10 MHz) | 4.58 / 0.0431 |
| Volume Resistivity | 6.57×10¹⁵ Ω·cm |
| Surface Resistivity | 2.41×10¹⁷ Ω |
