LOCTITE ECCOBOND E-1216M is an advanced, snap-curable epoxy underfill designed for high-volume electronic assembly operations. This innovative material ensures fast, void-free encapsulation of area array devices. It significantly enhances the reliability and mechanical integrity of critical electronic components.
General Information of LOCTITE ECCOBOND E-1216M
LOCTITE ECCOBOND E-1216M innovative capillary flow underfill features an epoxy-based technology, presenting as a black liquid. It utilizes a heat-cure mechanism, enabling rapid processing within a single reflow cycle. Furthermore, this formulation is specifically engineered to be anhydride-free, catering to users who prefer such chemistries. Consequently, it offers excellent stability during shipping, storage, and application, even in large volume cartridges.
This product also meets stringent quality benchmarks. LOCTITE ECCOBOND E-1216M passes NASA outgassing standards, confirming its suitability for demanding applications where material emissions are critical. Its robust chemical composition ensures consistent performance and long-term reliability in diverse industrial environments.
Key Features & Technical Benefits
- Snap Curable: Enables extremely fast curing times, significantly accelerating production throughput.
- Fast, Void-Free Underfill: Ensures complete and uniform encapsulation of area array devices, preventing defects and enhancing reliability.
- Excellent Stability: Maintains consistent material properties during storage and use, ensuring reliable dispensing and performance.
- Excellent Adhesion and Strength: Provides robust mechanical bonding and structural reinforcement for delicate electronic components.
- Non-Anhydride Curing Chemistry: Offers a preferred formulation for specific user requirements and environmental considerations.
- Passes NASA Outgassing: Meets rigorous standards for low volatile organic compound emissions, suitable for sensitive applications.
Typical Industrial Applications
This formulation is engineered for the following applications:
- Underfill for electronic packages
- Chip Scale Package (CSP) reinforcement
- Ball Grid Array (BGA) protection
- Flip Chip BGA encapsulation
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
| Technology | Epoxy |
| Appearance | Black |
| Cure | Heat cure |
| Viscosity, Brookfield (Spindle 4, 20 rpm) | 4,000 mPa·s (cP) |
| Flow Rate @ 80°C (1cm travel, 200µm gap) | 9 seconds |
| Specific Gravity | 1.4 |
| Work Life @ 25°C (50% increase in viscosity) | 5 days |
| Shelf Life @ -20°C | 365 days |
| Hardness, Shore D @ 25ºC | 86 |
| Coefficient of Thermal Expansion (Below Tg) | 35 ppm/ºC |
| Coefficient of Thermal Expansion (Above Tg) | 131 ppm/ºC |
| Glass Transition Temperature (Tg) by TMA | 125 °C |
| Thermal Conductivity, Laser Flash | 0.42 W/(m·K) |
| Flexural Modulus @ 25°C | 6,010 N/mm² (872,000 psi) |
| Dielectric Constant / Dissipation Factor @ 23°C, 5GHz | 3.19 / 0.018 |
| Volume Resistivity | 2.82×10+16 ohm-cm |
| Surface Resistivity | 1.09×10+14 ohm |
| Dielectric Strength | 42 kV/mm |
