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Home > Products > By Market > General Industrial > LOCTITE ABLESTIK ATB 120U

LOCTITE ABLESTIK ATB 120U

  • Product code: ABLESTIK ATB 120U
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 274 days

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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
    • FEATURES OF ATB 120U
  • About Prostech

LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach

LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.

These adhesive film should be stored at 5ºC, in its original moisture resistant packaging.  Partially used reels should be stored under dry conditions at 5ºC

FEATURES OF ATB 120U

  • Non-conductive
  • Fast cure
  • Thin bondline
  • Excellent gap filling ability
  • L2/260°C performance

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

Wafer Backside Lamination  

Temperature, °C 

Pressure, psi 

Taping Duration, ft/ minute 

65 to 70

40

1

Chip Attach  

Temperature, °C

Pressure, kg-f

Attach Duration, second

100 to 120

0.5 to 2

1 to 2

Glass Transition Temperature (Tg) by TMA, °C 75
Thermal Conductivity , W/(m-K) 0.21

TDS:Download

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    Outstanding Feature Product Group

    • adhesive henkel

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