XE14-TM009 is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-TM009 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.
KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
APPLICATIONS
Thermal interface for electronic components in Automotive, Consumer, Telecommunication,
Lighting and Industrial applications
