Liquid-Dispensed Silicone Thermal Pad/ GapFiller SilCool TIA265GF (XE14-D0034)

Product code: TIA265GF (XE14-D0034)
Manufacturer: Momentive
Package size:
Shelf Life:

SilCool TIA265GF (XE14-D0034) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. TIA26GF can be used as liquid dispensed alternative to pre-fabricated Thermal Pads, for a broad array of thermal designs in electronic applications.

KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
• Typical Operating Temp Range -40° to 150°C

APPLICATIONS

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

Đặc điểm	TIA 265GF XE14-D0034 (A)	TIA 265GF XE14-D0034 (B)
Màu (Thành phần A & Thành phần B)	hồng	hồng nhạt
Độ nhớt*1 Pa⋅s	230	225
Tỷ lệ trộn theo trọng lượng	1:1	1:1
Độ nhớt sau khi trộn Pa⋅s	184	184
Chỉ số lưu biến	2.6	2.6
Thời gian thao tác @ 23°C (giờ)	1	1
Điều kiện khô @ 70°C @ 23°C (hours)	1 24	1 24