Liquid Dispense Gap Fillers Silcool TIA225GF

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

Key Features 

• Good thermal conductivity
• Fast low-temperature cure
• Retains softness after cure to enhance stress relief during thermal cycling
• Easy to use 1:1 mixing ratio
• Conforms to complex shapes of three-dimensional interface designs
• Can be dispensed or printed
• Repairable
• Flame retardant: UL94V-0 equivalent

Applications 

Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.