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Liquid Dispense Gap Fillers Silcool TIA225GF

  • Product code: TIA225GF
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  • Package size:
  • Shelf Life:
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TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

Key Features 

  • Good thermal conductivity
  • Fast low-temperature cure
  • Retains softness after cure to enhance stress relief during thermal cycling
  • Easy to use 1:1 mixing ratio
  • Conforms to complex shapes of three-dimensional interface designs
  • Can be dispensed or printed
  • Repairable
  • Flame retardant: UL94V-0 equivalent

Applications 

Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.

 

 

Property   TIA225GF
Appearance    Xám
Density (23°C) g/cm3 2.90
Thermal conductivity W/(m·K) 2.5
Thermal resistance mm2·K/W 35
Hardness (Type E)   20
Tensile strength MPa 0.4
Elongation

%

70
Volume resistivity

MΩ∙m

6.0×106
Dielectric strength

kV/mm

20
CTE *3

ppm/K

120
Low volatile siloxane (D4
-D10)

ppm

200
Viscosity (23°C)

Pa・s

100
Mixing ratio (theo trọng lượng)

 

100:100
Viscosity after mixing (23°C)

Pa・s

100
Pot life

h

4
Curing condition (70°C)
                             (23°C)

h

h

0.5

24

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