TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
Key Features
- Good thermal conductivity
- Fast low-temperature cure
- Retains softness after cure to enhance stress relief during thermal cycling
- Easy to use 1:1 mixing ratio
- Conforms to complex shapes of three-dimensional interface designs
- Can be dispensed or printed
- Repairable
- Flame retardant: UL94V-0 equivalent
Applications
Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.
| Property | TIA225GF | |
| Appearance | Xám | |
| Density (23°C) | g/cm3 | 2.90 |
| Thermal conductivity | W/(m·K) | 2.5 |
| Thermal resistance | mm2·K/W | 35 |
| Hardness (Type E) | 20 | |
| Tensile strength | MPa | 0.4 |
| Elongation | % | 70 |
| Volume resistivity | MΩ∙m | 6.0×106 |
| Dielectric strength | kV/mm | 20 |
| CTE *3 | ppm/K | 120 |
| Low volatile siloxane (D4 -D10) | ppm | 200 |
| Viscosity (23°C) | Pa・s | 100 |
| Mixing ratio (theo trọng lượng) |
| 100:100 |
| Viscosity after mixing (23°C) | Pa・s | 100 |
| Pot life | h | 4 |
| Curing condition (70°C) (23°C) | h h | 0.5 24 |
