Liquid Dispense Gap Fillers Silcool TIA223G-DG

TIA223G-DG is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks. The flowability of TIA223G-DG allows it to conform to complex 3-dimensional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.
TIA223G-DG quickly cures to a soft rubber gel with exposure to heat and will also cure at room temperatures.

KEY FEATURES
• Good thermal conductivity
• Fast cure with exposure to heat
• Easy to use 1:1 mixing ratio by weight or volume

APPLICATIONS
Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic
components.