LiPOLY TT3000 is a Nano type thermal interface material based on a unique formula. TT3000’s formulation is solvent-free. We used a unique silicone oil which interacts with thermally conductive fillers, making the compounds extremely stable, preventing pump-out problems and other common failure mechanisms. TT3000 has high thermal conductivity, low thermal resistance, improving the components performance as well as the product lifecycle
FEATURE
- Thermal conductivity:6.0 W/m*K
- Excellent thermal conductivity
- Stable and homogeneous compound to ensure thermal performance
- Formula can fill the gap at low pressure
- High stability and reliability
- Solvent-free formula
- The product is qualified for ROHS and REACH
APPLICATION
- CPU and chip coolers
- Switching power supplies
- Between any heat-generating component and heat Sink
- 5G base station & infrastructure
- EV electric vehicle
PROPERTY |
TT3000 |
TEST METHOD |
UNIT |
Color |
White |
Visual |
– |
Resin base |
Silicone |
– |
– |
Filler |
Non-Metal |
– |
– |
Viscosity |
300 |
ISO 3219 |
Pa.s |
Density |
3.3 |
ASTM D792 |
g/cm³ |
Application temperature |
-60~180 |
– |
°C |
Bond line thickness |
10 |
– |
μm |
Shelf life |
60 months |
– |
– |
ROHS & REACH |
Compliant |
– |
– |
ELECTRICAL |
|||
Dielectric breakdown |
8 |
ASTM D149 |
KV/mm |
Volume resistivity |
>10¹² |
ASTM D257 |
Ohm-m |
THERMAL |
|||
Thermal conductivity |
6.0 |
ASTM D5470 |
W/m*K |
Thermal impedance@50psi |
0.007 |
ASTM D5470 |
°C-in²/ W |
Thermal impedance@50psi |
5.0 |
ASTM D5470 |
°C-mm²/ W |