JONES 21-460 is a silicone based, high performance thermal interface material with thermal conductivity at 6W/m.K. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS
High Thermal Conductivity: 6.0W/m·k｜ Moderate Viscosity For Easy Application｜ No Post “Cure” Required｜Low Thermal Resistance.
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
