LIPOLY AS200-s Ultra Low Oil-Bleed Thermal Conductive Gel Pad

LiPOLY AS200-s is a material designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore OO/35, with high flexibility and compressibility. AS200-s has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic components clean.

FEATURE

Thermal conductivity:2.0 W/m*K
High compressibility
Low oil-bleeding
Naturally tacky and high resilience

APPLICATION

Notebook computers
Heat pipe assemblies
TV hardware
Wireless communication hardware
High speed mass storage drives
Set top box
IP CAM
5G base station & infrastructure
EV electric vehicle

PROPERTY	AS200-s	TEST METHOD	UNIT
Color	Gray	Visual	–
Surface tack 2-side/1-side	2	–	–
Thickness	Customized	ASTM D374	mm
Density	2.2	ASTM D792	g/cm³
Hardness	35	ASTM D2240	Shore OO
Application temperature	-60~180	–	°C
ROHS & REACH	Compliant	–	–
COMPRESSION@1.0mm
Deflection @10 psi	10	ASTM D5470 modify	%
Deflection @20 psi	17	ASTM D5470 modify	%
Deflection @30 psi	26	ASTM D5470 modify	%
Deflection @40 psi	35	ASTM D5470 modify	%
Deflection @50 psi	39	ASTM D5470 modify	%
ELECTRICAL
Dielectric breakdown	12	ASTM D149	KV/mm
Surface resistivity	>10¹⁰	ASTM D257	Ohm
Volume resistivity	>10¹¹	ASTM D257	Ohm-m
THERMAL
Thermal Conductivity	2.0	ASTM D5470	W/m*K
Thermal impedance@10 psi	0.892	ASTM D5470	°C-in²/ W
Thermal impedance@20 psi	0.824	ASTM D5470	°C-in²/ W
Thermal impedance@30 psi	0.783	ASTM D5470	°C-in²/ W
Thermal impedance@40 psi	0.731	ASTM D5470	°C-in²/ W
Thermal impedance@50 psi	0.704	ASTM D5470	°C-in²/ W

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