JONES Thermal PAD 21-233-150-0816

JONES Thermal Pad 21-233 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-233 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.

FEATURE

Thermal Conductivity :3.0W/m·K
Very Good Thermal Performance
Good Compressibility and Elasticity
Tiny Outgassing
Designed For Smartphone Industry
Easy For Installation

APPLICATION

Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Power Electronics

Properties		Thermal Pad 21-233	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.0	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~200	JONES Test Method
Physical	Color	Grey	Visual
	Composition	Ceramic & Silicone	–
	Density (g/cm^3)	2.8	ASTM D792
	Thickness Range (mm)	0.5~5.0	ASTM D374
	Thickness Tolerance(mm)> 1mm	±10%	–
	Thickness Tolerance(mm)</= 1mm	±0.1	–
	Hardness (Shore 00)	40	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant@1MHz	7.6	ASTM D150
Regulatory	Flame Rating	V0	UL 94

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