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JONES Thermal PAD 21-233-150-0816

  • Product code: 21-233-150-0816
  • Manufacturer:
  • Package size: 16” X 8” (406mm X 203mm)
  • Shelf Life: 12 tháng

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JONES Thermal Pad 21-233 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-233 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.

FEATURE

  • Thermal Conductivity :3.0W/m·K
  • Very Good Thermal Performance
  • Good Compressibility and Elasticity
  • Tiny Outgassing
  • Designed For Smartphone Industry
  • Easy For Installation

APPLICATION

  • Memory Modules
  • Mass Storage Devices
  • Automotive Electronics
  • Telecommunication Hardware
  • Radios
  • Power Electronics

Properties

Thermal Pad 21-233

Test Method

 

Thermal

Thermal Conductivity (W/m·K)

3.0

ASTM D5470

Operating Temperature Range (°C)

-55~200

JONES Test Method

 

 

 

 

 

Physical

Color

Grey

Visual

Composition

Ceramic & Silicone

–

Density (g/cm^3)

2.8

ASTM D792

Thickness Range (mm)

0.5~5.0

ASTM D374

Thickness Tolerance(mm)> 1mm

±10%

–

Thickness Tolerance(mm)</= 1mm

±0.1

–

Hardness (Shore 00)

40

ASTM D2240

 

Electrical

Breakdown Voltage (KV AC/mm)

>5

ASTM D149

Volume Resistivity (Ohm·cm)

10^13

ASTM D257

Dielectric Constant@1MHz

7.6

ASTM D150

Regulatory

Flame Rating

V0

UL 94

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