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JONES Thermal Grease 21-430SF

  • Product code: 21-430SF
  • Manufacturer: Jones Tech
  • Package size: 60ml syringe
  • Shelf Life: 6 months

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JONES Thermal Grease 21-430SF is a silicone-free based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.

FEATURE

  • Thermal Conductivity: 3 W/m·K
  • Moderate Viscosity
  • Low Thermal Resistance
  • High Thermal Conductivity
  • Silicon-free
  • Solvent-free

APPLICATION

  • CPUs (Notebooks, PCs, Servers)
  • LED Solid State Lighting
  • GPUs

 

Properties

Thermal Grease 21-430SF

 

Test Method

 

 

Thermal

Thermal Conductivity (W/m·K)

3.0

ASTM D5470

Thermal Resistance @40 psi (°C·cm^2/W)

0.153

ASTM D5470

Operating Temperature Range(°C)

-40~125

JONES Test Method

 

 

 

Physical

Color

Grey

Visual

Composition

Ceramic&Silicone-free

–

Typical Minimum Bondline Thickness (μm)

25

JONES Test Method

Viscosity @20rpm (Pa·s)

150

ASTM D2196

Density (g/cm³)

2.3

ASTM D792

 

 

Electrical

Breakdown Voltage (KV AC /mm)

>12

ASTM D149

Volume Resistivity (Ohm·cm)

10^12

ASTM D257

Dielectric Constant @1MHz

4.8

ASTM D150

Regulatory

Flame Rating

V0

UL 94

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