JONES Thermal Grease 21-430 55cc cartridge (120g)

JONES Thermal Grease 21-430 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.

FEATURE

Thermal Conductivity: 3.3W/m·K
Moderate Viscosity For Easy Application
No post “Cure” required
High Thermal Conductivity
No Dry Out @150℃
Solvent-free

APPLICATION

CPUs (Notebooks, PCs, Servers)
LED Solid State Lighting
GPUs’
Northbridge Chipsets
ASICS Chips

Properties		Thermal Grease 21-430	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.3	HOT DISK
	Thermal Resistance @40 psi (°C·cm^2/W)	0.119	ASTM D5470
	Operating Temperature Range(°C)	-40~150	JONES Test Method
Physical	Composition	Ceramic&Silicone	–
	Color	Grey	Visual
	Typical Minimum Bondline Thickness (μm)	50	JONES Test Method
	Viscosity @20rpm (Pa·s)	350	ASTM D2196
	Density (g/cm³)	2.4	ASTM D792
Electrical	Breakdown Voltage (KV AC /mm)	>5.0	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant @1MHz	5.3	ASTM D150
Regulatory	Flame Rating	V0	UL 94

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