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JONES Thermal Gel 21-361-SP02

  • Product code: 21-361-SP02
  • Manufacturer: Jones Tech
  • Package size: 300 CC Cartridge (800 g)/ 5 Gallon Pail(25 Kg)
  • Shelf Life: 6 months

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JONES Thermal Gel 21-361-SP02 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink. JONES Thermal Gel 21-361-SP02 has a composition which yields superior thermal performance and super compliancy. This material transfers little to no pressure between interfaces. Specialized rheology allows for easy flow under pressure.

FEATURE

  • Thermal Conductivity: 6.0 W/m-K
  • High Reliability
  • Easily Dispensable
  • Pre-Cured
  • Electrically Isolating
  • Low Thermal Resistance

APPLICATION

  • Cooling components to chassis, frame, or other mating components
  • Memory modules
  • Mass storage devices
  • Automotive electronics
  • Telecommunication hardware
  • Power electronics
  • LCD and PDP flat panel
  • Audio and video component
  • IT infrastructure
  • GPS navigation and other portable devices

 

Properties

Thermal Gel 21-361-SP02

 

Test Method

 

 

Thermal

Thermal Conductivity (W/m·K)

6.0

ASTM D5470

Thermal Resistance (°C.cm^2/W) @1mm

–

ASTM D5470

Operating Temperature Range (°C)

-55~150

JONES Test Method

 

 

 

 

Physical

Color

Pink

Visual

Composition

Ceramic & Silicone

–

Density (g/cc)

3.4

ASTM D792

Flow Rate (g/min)

25

90 Psi,EFD50cc @ Ø2.41mm nozzle

Typical Minimum Bondline Thickness (mm)

0.15

JONES Test Method

 

 

Electrical

Breakdown Voltage (KV AC /mm)

> 6

ASTM D149

Volume Resistivity (Ohm·cm)

10^13

ASTM D257

Dielectric Constant @1MHz

11.0

ASTM D150

Regulatory

Flammability Rating

V0

UL 94

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