JONES 21-745, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids. At room temperature, JONES PCM 21-745 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to heat sink or component surface. Upon reaching its softening temperature of 50 °C, PCM 21-745 begins to soften and Gow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.
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Testing sample quality and verifying product compatibility in our laboratory
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