JONES 21-340-SP01 Single Part Thermal Gel

JONES Thermal Gel 21-340-SP01 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances presently and low mechanical stress on delicate components . It is ideal for filling variable gaps between multiple components and a common heat sink.

FEATURES AND BENEFITS

Thermal Conductivity: 3.5 W/m-K｜Soft and Compliant Transferring Little To No Pressure Between Interfaces｜Pre-Cured｜Electrically Isolating｜Low Thermal Resistance｜Easily DispensableRegulatory｜

APPLICATIONS

Cooling components to chassis, frame, or other mating components｜Memory modules｜Mass storage devices｜Automotive electronics｜ Telecommunication hardware｜Power electronics｜LCD and PDP Gat panel｜Audio and video component｜IT infrastructure｜GPS navigation and other portable devices.

21-340-SP01 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.5	ASTM D5470
	Thermal Resistance (°C.cm^2/W) @1mm	/	ASTM D5470
	Operating Temperature Range (°C)	-55~150	JONES Test Method
Physical	Color	Green	Visual
	Composition	Ceramic & Silicone	/
	Density (g/cc)	3.2	ASTM D792
	Flow Rate (g/min)	48	90 Psi,EFD180cc @ Ø 3.17mm nozzle
	Typical Minimum Bondline Thickness (mm)	0.10	JONES Test Method
Electrical	Breakdown Voltage (KV AC /mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant @1MHz	5.0	ASTM D150
Regulatory	Flammability Rating	V0	UL94

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