JONES Thermal Gel 21-335D is a two-part dispensable materials compounded with thermal conductive fillers and silicone matrix. It demonstrates high thermal conductivity, goodthermal performance and high reliability. In addition to providing variable gap adaption, it will impart little and reduced stress on components during assembly.JONES Thermal Gel 21-335D is ideal for applications that require a higher Gow rate and easy reworking.
FEATURES AND BENEFITS
Thermal Conductivity :3.5W/m·k｜Minimal stress imparted to components during assembly｜Easy for rework｜Cured at room Temperature｜Electrically Isolating｜Low Thermal Resistance｜Easily dispensable｜ High Reliability.
APPLICATIONS
Cooling components to chassis, frame, or other mating components｜ Home & Small Office Network｜Mass Storage Devices｜ Automotive Electronics｜ Telecommunication Hardware｜LED Solid State Lighting｜Power Electronics.
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21-335D TYPICAL PROPERTIES |
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Properties |
Typical Properties |
Test Method |
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Thermal |
Thermal Conductivity(W/m·K) |
3.5 |
ASTM D5470 |
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Operating Temperature Range(°C) |
-55~150 |
JONES Test Method |
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Physical |
Composition |
Ceramic & Silicone |
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Color |
PartA: Green PartB: White |
Visual |
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Flow rate (g/min)_mixed |
21 |
90 Psi,EFD50cc @ 21 Elements static mixer |
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Density (g/cc) |
3.0 |
ASTM D792 |
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Mix Ratio |
1:1 |
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Pot Life after mixing@25°C(h) |
3 |
Time for Viscosity to Double |
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Cure Condition@25°C(h) |
24 |
Rheometer |
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Cure Condition@120°C(min) |
20 |
Rheometer |
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Color after curing |
Light Green |
Visual |
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Hardness (Shore 00) |
45 |
ASTM D2240 |
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Electrical |
Breakdown Voltage(KV AC/mm) |
>5 |
ASTM D149 |
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Volume Resistivity(Ohm·cm) |
10^13 |
ASTM D257 |
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Dielectric Constant @1MHz |
5.9 |
ASTM D150 |
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Regulatory |
Flammability Rating |
V0 |
UL94 |
