JONES 21-233-SP01 Series Thermal Pads

JONES Thermal Pad 21-233-SP01 is designed to provide good thermal performance and adhesion or naturaltack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression.

FEATURES AND BENEFITS

Thermal Conductivity :3.0W/m·K
Single-Side Sticky
Very Good Thermal Performance
Good Compressibility and Elasticity
Tiny Outgassing｜Easy For Installation

APPLICATIONS

Memory Modules｜ Mass Storage Devices｜
Automotive Electronics｜Telecommunication
Hardware｜Radios｜Power Electronics｜
Smartphone Industry

21-233-SP01 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.0	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~200	JONES Test Method
Physical	Color	Light Blue	Visual
	Composition	Ceramic & Silicone	/
	Density (g/cm^3)	3.0	ASTM D792
	Thickness Range (mm)	0.5~5.0	ASTM D374
	Thickness Tolerance(mm)> 1mm	±10%	/
	Thickness Tolerance(mm)</= 1mm	±0.1	/
	Hardness (Shore 00)	25	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant@1MHz	5.0	ASTM D150
Regulatory	Flame Rating	V0	UL94

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