JONES 21-117 Series Thermal Pads

JONES Thermal Pad 21-117 is a soft and conformable material. It is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression.

FEATURES AND BENEFITS

Thermal Conductivity :1.7W/m·K
Cost-Effective Solution
Higher Breakdown Voltage
Ultra Thin (fiber-enhanced)
Easy For Installation

APPLICATIONS

Memory Modules｜ Mass Storage Devices｜
Automotive Electronics｜Telecommunication
Hardware｜Radios｜Power Electronics｜ Set-Top Boxes

21-117 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	1.7	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~200	JONES Test Method
Physical	Color	Black	Visual
	Composition	Ceramic & Silicone	/
	Density (g/cm^3)	2.6	ASTM D792
	Thickness Range (mm)	0.3~5.0	ASTM D374
	Thickness Tolerance (mm) > 1	±10%	/
	Thickness Tolerance (mm) </= 1	±0.1	/
	Hardness (Shore 00)	60	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant@1MHz	3.7	ASTM D150
Regulatory	Regulatory	V0	UL94

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