JE136-5 is two component epoxy for the application of electronic devices potting. This product has low shrinkage and high thermal conductivity after cured, and it is suited for electronic devices and motors potting. This resin has good thermal shock resistance, it is suit for encapsulation of various components and modules. This product exhibits high adhesion strength, greasy resistance, chemical and solvent resistance. The crack and fatigue resistance of this resin are outstanding in many vibrational applications. The durability of this product is very high levels and this resin can pass many environmental test experiments.
Features
1. This product is solvent-free, two component epoxy resin.
2. This product has good heat tolerance.
3. This product has excellent thermal shock resistance.
4. It won’t exhibits excess stress when heating.
5. This product has good thermal conductivity.
6. The cured product of this product is effective against moisture and water.
7. This resin has excellent dimensional stability over a wide temperature range.
8. This resin complies to the 2011/ 65/EU RoHS regulations.
9. This product obeyes UL94 HB regulations.
Typical Uncured Properties
JE136-5A
JE136-5B
Appearance
Liquid
Liquid
Color
Black
Gray
Viscosity* 25oC, cps
125,000~250,000 (S14 5 rpm)
30,000~60,000 (S14 50rpm)
Mixing Viscosity* 25ºC, cps
25,000~50,000 (S14 50 rpm)
Mixing Viscosity* 60ºC, cps
4,000~8,000 (S14 100 rpm )
Specific Gravity
2.23
2.23
Test method: Refer to ASTM D-1084-88，Brookfield RVD-I + Viscosmeter.
Typical Curing Properties
Mix Ratio (A：B) by Weight
1：1
Pot Life, 25oC, hr
4
Cured Time, 120ºC, hr
3
Cured Time, 130ºC, hr
1
Typical Cured Properties*1
Glass Transition Temp., (DSC), ºC
130
CTE*2 (<Tg), μm/m/ ºC
38
CTE* 2 (>Tg) ,μm/m/ ºC
100
Durometer Hardness, Shore D*3
91
Specific Gravity
2.26
Water Absorption Ratio (25ºC /24hr), %
0.02
Water Absorption Ratio (80ºC /24hr), %
0.13
Water Absorption Ratio (97ºC /1.5hr), %
0.08
Degradation Temp. (TGA 10ºC /min), ºC
342
Thermal Conductivity, W/mK
1.3
Volume Resistivity, ohm-cm
2.5*10^15
Dielectric Strength, Kv/mm
25
Dielectric Constant, 60Hz
3.4
Bending Strength, MPa
120
Temperature Range, ºC
-40 ~ 200
*1 Specimen Cure Condition：130ºC /1hr
*2 CTE: Coefficient of Thermal Expansion
*3 Test method: Refer to ASTM D 2240-03，Durometer D Type
