Home > Products > By Application > Adhesives > JD 551-5- One Component Epoxy Adhesive
Prostech Everwide JE085-2 One Component Epoxy Adhesive

JD 551-5- One Component Epoxy Adhesive

  • Product code: JD 551-5
  • Manufacturer: Everwide
  • Package size:
  • Shelf Life: 6 months @-40oC ~ -5oC

Request Quote Request Sample

JD551-5 is one component epoxy adhesive for electronic devices bonding. This resin can be fast cure at low temperature and has good fluidity. After curing, this product exhibits good adhesion strength and is suitable for different kinds materials bonding, it is especially good for plasitcs bonding. The durability of this product is very high levels and this resin is able to pass many environmental test experiments. This product is well suited for heat sensitive components bonding, Memory cards and C-MOS assembling.

FEATURES

1. This product is solvent-free and non-volatile system.
2. The hardening surface will not exhibit a surface oiliness. Cured product has poor gloss.
3. This resin offers excellent retention of electrical insulation properties under high humidity conditions.
4. This resin offers excellent chemical resistance and solvent resistance.
5. It is highly vibrate-resist at ordinary temperature.
6. This product complies to the 20 11 / 6 5 E U RoHS regulations
7. This product complies to chlorine < 900ppm, bromine <
900ppm, chlorine + bromine <1500 ppm

Typical Uncured Properties

AppearanceLiquid
ColorBlack
Viscosity 25oC, S14 100rpm, cps2,300~3,500

Typical Cured Properties

Glass Transition Temp.,(MDSC), oC40
CTE*2 (<Tg ), μm/ oC76
CTE*2 (>Tg ), μm/ o C164
Specific Heat 25oC, J/goC1.25
Durometer Hardness, Shore D81
Specific Gravity1.25

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Yincae Wafer Level Underfill WTA-60
    Yincae Wafer Level Underfill WTA-60
    https://prostech.vn/yincae-wafer-level-underfill-wta-60/

    General Information of Yincae Wafer Level Underfill WTA-60Key Features & Technical BenefitsTypical Industrial Applications Yincae Wafer Level Underfill WTA-60 is

    Yincae Thermal Interface Material TM-150
    Yincae Thermal Interface Material TM-150
    https://prostech.vn/yincae-thermal-interface-material-tm-150/

    General Information of Yincae Thermal Interface Material TM-150Key Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Interface Material TM-150 is

    Yincae Thermal Conductive Adhesive TGP-88A
    Yincae Thermal Conductive Adhesive TGP-88A
    https://prostech.vn/yincae-thermal-conductive-adhesive-tgp-88a/

    General Information of Yincae Thermal Conductive Adhesive TGP-88AKey Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Conductive Adhesive TGP-88A is

    Yincae Solderable Conductive Adhesive TM-150E
    Yincae Solderable Conductive Adhesive TM-150E
    https://prostech.vn/yincae-solderable-conductive-adhesive-tm-150e/

    General Information of Yincae Solderable Conductive Adhesive TM-150EKey Features & Technical BenefitsTypical Industrial Applications Yincae Solderable Conductive Adhesive TM-150E is