• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Application > Adhesives > Hot melt PUR > HB Fuller TL5408D Reactive Hot Melt Adhesive
HB Fuller TL365NS Reactive Hot Melt Adhesive Prostech Vietnam

HB Fuller TL5408D Reactive Hot Melt Adhesive

Polyurethane based reactive hot melt adhesive

  • Product code: TL5408D
  • Manufacturer: H. B. Fuller
  • Package size: Drum(200Kg), Pail(18Kg), slug(2Kg).
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Features
  • Applications of TL5408D

HB Fuller TL5408D is designed for the high water repellent treated fabrics including nylon fabric and polyester fabric. It has a suitable initial tack to unsure the on line processing. After cured, it is soft and elastic.

Features

  • There is no UV indicator in this product.
  • Open time over 5 minutes
  • Working temperature ~ 90-100 °C
  • Applied in lamination machine, put the glue in the middle of appliation coaters
  • Final cure is achieved by reaction with ambient moisture or moisture from the substrate.
  • Curing time depends on the access of humidity to the bonding seam
  • Clean, good sealant and dry conditions within 5°C and 30°

Applications of TL5408D

  • Lamination of textile fabric, non-woven substrates, synthetic foam, film, breathable film.

 

Mật độxấp xỉ 1.10 g/cm3 at 20°C
Độ nhớt xấp xỉ 3,600 cps at 90°C
 xấp xỉ 6,200 cps at 80°C
Màu sắcVàng nhạt, trắng

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Yincae Wafer Level Underfill WTA-60
    Yincae Wafer Level Underfill WTA-60
    https://prostech.vn/yincae-wafer-level-underfill-wta-60/

    General Information of Yincae Wafer Level Underfill WTA-60Key Features & Technical BenefitsTypical Industrial Applications Yincae Wafer Level Underfill WTA-60 is

    Yincae Thermal Interface Material TM-150
    Yincae Thermal Interface Material TM-150
    https://prostech.vn/yincae-thermal-interface-material-tm-150/

    General Information of Yincae Thermal Interface Material TM-150Key Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Interface Material TM-150 is

    Yincae Thermal Conductive Adhesive TGP-88A
    Yincae Thermal Conductive Adhesive TGP-88A
    https://prostech.vn/yincae-thermal-conductive-adhesive-tgp-88a/

    General Information of Yincae Thermal Conductive Adhesive TGP-88AKey Features & Technical BenefitsTypical Industrial Applications Yincae Thermal Conductive Adhesive TGP-88A is

    Yincae Solderable Conductive Adhesive TM-150E
    Yincae Solderable Conductive Adhesive TM-150E
    https://prostech.vn/yincae-solderable-conductive-adhesive-tm-150e/

    General Information of Yincae Solderable Conductive Adhesive TM-150EKey Features & Technical BenefitsTypical Industrial Applications Yincae Solderable Conductive Adhesive TM-150E is

    Similar Products

    • Yincae Wafer Level Underfill WTA-60

      Yincae Wafer Level Underfill WTA-60

      See details
    • Yincae Thermal Interface Material TM-150

      Yincae Thermal Interface Material TM-150

      See details
    • Yincae Thermal Conductive Adhesive TGP-88A

      Yincae Thermal Conductive Adhesive TGP-88A

      See details
    • Yincae Solderable Conductive Adhesive TM-150E

      Yincae Solderable Conductive Adhesive TM-150E

      See details
    HB Fuller TL5408D Reactive Hot Melt Adhesive

      Leave your information via Form, our Technical Support Team will contact you shortly!

      HB Fuller TL5408D Reactive Hot Melt Adhesive

        Leave your information via Form, our Technical Support Team will contact you shortly!

        HB Fuller TL5408D Reactive Hot Melt Adhesive

          Leave your information via Form, our Technical Support Team will contact you shortly!

          HB Fuller TL5408D Reactive Hot Melt Adhesive

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!