Product Description
JD 322 is an advanced one-component epoxy adhesive specifically engineered for robust bonding applications in electronic devices. This high-performance resin delivers exceptional adhesion strength and is characterized by its ability to achieve fast curing at relatively low temperatures. Formulated for versatility, it is suitable for bonding various materials, demonstrating particular efficacy with plastics. The adhesive boasts a very high durability level, successfully passing numerous rigorous environmental tests, making it an ideal choice for securing heat-sensitive components such as memory cards and C-MOS assemblies.
This solvent-free system is designed for ease of use and long-term reliability, providing excellent retention of electrical insulation properties even under high humidity conditions, along with superior chemical and solvent resistance. Its dimensional stability across a wide temperature range and high vibration resistance further enhance its suitability for demanding electronic applications.
Key Features
- Solvent-free and non-volatile system.
- Hardening surface will not exhibit surface oiliness.
- Excellent retention of electrical insulation properties under high humidity conditions.
- Superior chemical resistance.
- Outstanding solvent resistance.
- Highly vibration-resistant at ordinary temperatures.
- Excellent dimensional stability over a wide temperature range.
- Compliant with 2011/65/EU RoHS regulations.
- Low halogen content: Chlorine < 900ppm, Bromine < 900ppm, Chlorine + Bromine < 1500ppm.
- Fast curing at low temperatures, ideal for heat-sensitive components.
- Versatile bonding across different kinds of materials, especially plastics.
- High durability, successfully passing multiple environmental test experiments.
Technical Specifications
| Property | Value |
| Typical Uncured Properties | |
| Appearance | Liquid |
| Color | Black |
| Viscosity @ 25°C, S14 5rpm | 128,000 ~ 192,000 cps |
| Thixotropic Index | 4 ~ 6 |
| Filler grain size | 2 ~ 5 µm (Max < 10 µm) |
| Filler ratio | 23 % |
| Chloride (Cl) | < 50 ppm |
| Potassium (K) | < 10 ppm |
| Sodium (Na) | < 30 ppm |
| Typical Curing Properties | |
| Pot Life @ 25°C | 2 days |
| Recommended Cure Time @ 80°C | 60 min |
| Recommended Cure Time @ 90°C | 50 min |
| Recommended Cure Time @ 100°C | 40 min |
| Recommended Cure Time @ 120°C | 30 min |
| Recommended Cure Time @ 150°C | 20 min |
| Typical Cured Properties | |
| Glass Transition Temp. (DSC) | 132 °C |
| Glass Transition Temp. (TMA) | 152 °C |
| Coefficient of Thermal Expansion (<Tg) | 48 µm/m/°C |
| Coefficient of Thermal Expansion (>Tg) | 162 µm/m/°C |
| Specific Heat @ 0°C | 0.92 J/g°C |
| Specific Heat @ 25°C | 1.01 J/g°C |
| Specific Heat @ 50°C | 1.10 J/g°C |
| Specific Heat @ 75°C | 1.18 J/g°C |
| Specific Heat @ 100°C | 1.26 J/g°C |
| Durometer Hardness | 90 Shore D |
| Specific Gravity | 1.33 |
| Water Absorption Ratio (25°C / 24hr) | 0.36 % |
| Water Absorption Ratio (80°C / 24hr) | 1.54 % |
| Water Absorption Ratio (97°C / 1.5hr) | 0.86 % |
| Shear Strength (LCP vs. PCB-FR4, cured 80°C/60min) | 102 kg/cm² |
| Shear Strength (LCP vs. PCB-FR4, cured 90°C/50min) | 135 kg/cm² |
| Shear Strength (LCP vs. PCB-FR4, cured 100°C/40min) | 156 kg/cm² |
| Shear Strength (LCP vs. PCB-FR4, cured 120°C/60min) | 197 kg/cm² |
| Shear Strength (LCP vs. PCB-FR4, cured 150°C/20min) | 173 kg/cm² |
| Shear Strength (LCP vs. PCB-FR4, cured 150°C/60min) | 218 kg/cm² |
| Thrust force (PC vs. PCB-FR4) | 12.6 kg |
| Thrust force (PC vs. IR Glass) | 13.8 kg |
| Thrust force (PA vs. PCB-FR4) | 10.4 kg |
| Thrust force (PA vs. IR Glass) | 12.4 kg |
| Thrust force (LCP vs. PCB-FR4) | 11.4 kg |
| Thrust force (LCP vs. IR Glass) | 12.2 kg |
| Thrust force (LCP lid vs. Epoxy) | 13.5 kg |
| Thrust force (SBS vs. Epoxy) | 2.1 kg |
| Thrust force (FR4 vs. Stainless Steel) | 12.9 kg |
| Thrust force (LCP vs. Stainless Steel) | 9.6 kg |
| Thrust force (Wafer Die vs. PCB) | 8.5 kg |
| Breaking Strength (Epoxy sheet) | 285 kg/cm² |
| Elongation | 7.2 % |
| Degradation Temp. (TGA 10°C/min) | 413 °C |
| Weight Loss Ratio @ 100°C | < 0.5 % |
| Weight Loss Ratio @ 150°C | < 0.5 % |
| Weight Loss Ratio @ 200°C | < 0.5 % |
| Weight Loss Ratio @ 250°C | < 0.5 % |
| Weight Loss Ratio @ 300°C | < 0.5 % |
| Weight Loss Ratio @ 350°C | 1.15 % |
| Flexural Module | 11 GPa |
| Young’s modulus | 8 GPa |
| Volume Shrinkage | 2.9 % |
| Thermal Conductivity | 0.5 W/mK |
| Thermal Resistance | 0.006 m²K/W |
| Volume Resistivity | 4.5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Dielectric Constant @ 100Hz | 5.6 |
| Dielectric Constant @ 10KHz | 5.4 |
| Dielectric Constant @ 1MHz | 5.2 |
| Dielectric Strength | 16 KV/mm |
| Temperature Resistance Range | -40 ~ 150 °C |
