• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Market > Electronics > Everwide JC821-51 One Component Epoxy Adhesive
everwide

Everwide JC821-51 One Component Epoxy Adhesive

  • Product code: Everwide JC821-51
  • Manufacturer: Everwide
  • Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
  • Shelf Life: 6 months

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

JC821-51 is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength. This resin can be fast cure at low temperatures and is suited for different kinds of materials bonding, it is especially good for plastics bonding. The durability of this product is very high levels and this resin can pass many environmental test experiments. This product is well suited for heat-sensitive components bonding, Memory cards, and C-MOS assembling.

FEATURES:

  • This product is the solvent-free and non-volatile system.
  • The hardening surface will not exhibit a surface oiliness.
  • This resin offers excellent retention of electrical insulation properties under high humidity conditions.
  • This resin offers excellent chemical resistance and solvent resistance.
  • It is highly vibrate-resist at ordinary temperatures.
  • This product complies with the 2011/ 65/EU RoHS regulations.
  • This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.
AppearanceLiquid
ColorBlack
Viscosity 25oC, S14 50rpm, cps18,000 ~ 30,000
Thixotropic Index> 2.6
Pot Life 25oC, days3
Recommended Cure Time 80oC, min60
Recommended Cure Time 90oC, min60
Recommended Cure Time 120oC, min45
Recommended Cure Time 150oC, min30

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    3M Automotive High-Bond Attachment Tape 06388
    3M Automotive High-Bond Attachment Tape 06392
    https://prostech.vn/3m-automotive-high-bond-attachment-tape-06392/

    General Information of 3M Automotive High-Bond Attachment Tape 06392Key Features & Technical BenefitsTypical Industrial Applications 3M Automotive High-Bond Attachment Tape

    3M Automotive High-Bond Attachment Tape 06388
    3M Automotive High-Bond Attachment Tape 06391
    https://prostech.vn/3m-automotive-high-bond-attachment-tape-06391/

    General Information of 3M Automotive High-Bond Attachment Tape 06391Key Features & Technical BenefitsTypical Industrial Applications 3M Automotive High-Bond Attachment Tape

    3M Automotive High-Bond Attachment Tape 06388
    3M Automotive High-Bond Attachment Tape 06390
    https://prostech.vn/3m-automotive-high-bond-attachment-tape-06390/

    General Information of 3M Automotive High-Bond Attachment Tape 06390Key Features & Technical BenefitsTypical Industrial Applications 3M Automotive High-Bond Attachment Tape

    3M Automotive High-Bond Attachment Tape 06388
    3M Automotive High-Bond Attachment Tape 06389
    https://prostech.vn/3m-automotive-high-bond-attachment-tape-06389/

    General Information of 3M Automotive High-Bond Attachment Tape 06389Key Features & Technical BenefitsTypical Industrial Applications 3M Automotive High-Bond Attachment Tape

    Similar Products

    • HB-Fuller-Cyberbond-Apollo-2028-Cyanoacrylate-Adhesive-Clear-1-lb-Bottle

      HB Fuller Cyberbond Apollo 2028 Cyanoacrylate Adhesive

      See details
    • LOCTITE STYCAST PC-40-UMF

      LOCTITE STYCAST PC-40-UMF

      See details
    • Momentive Silicone Sealant White 10.1 Cartridge - RTV160

      Momentive Silicone Sealant White 10.1 Cartridge – RTV160

      See details
    • YINCAE-industrial-materials

      Yincae Non-Conductive DA 90B

      See details
    Everwide JC821-51 One Component Epoxy Adhesive

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Everwide JC821-51 One Component Epoxy Adhesive

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Everwide JC821-51 One Component Epoxy Adhesive

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Everwide JC821-51 One Component Epoxy Adhesive

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!