Everwide FD020 UV / Moisture Dual Photo-curing Adhesive

Product Description

• A specialized adhesive from Everwide Chemical Co., Ltd., designed for dual UV and moisture curing, ensuring complete polymerization even in areas inaccessible to UV light.
• Specifically formulated to reinforce PVC, PET, and PI connectors with metal components, preventing issues from uncured monomers that could compromise electrical performance.
• Offers a rapid-curing feature making it ideal for high-volume electronic industry encapsulation processes, without bonding to skin or attracting dust during handling.
• Boasts exceptional strength that resists external forces and absorbs fracture energy, contributing to the long-term durability of bonded assemblies, with hardness increasing over time.
• Complies fully with the 2011/65/EU RoHS regulations, making it a responsible choice for modern electronic manufacturing.

Key Features

• Suited for various plastics bonding.
• Exhibits high strength and absorbs fracture energy effectively.
• Applicable for encapsulation purposes in electronic components.
• Hardness of the product gradually increases over time.
• Complies with the 2011/65/EU RoHS regulations for hazardous substances.