Everwide JC 823 Epoxy

Product Description

• This advanced, one-component epoxy adhesive from Everwide Chemical is expertly formulated for critical BGA and CSP chip encapsulation.
• Engineered for seamless operation, it is highly suitable for diverse electronic component applications, including precise casting and reliable sealing.
• Achieve accelerated production cycles with its fast-curing properties at elevated temperatures, significantly boosting operational efficiency.
• It forms exceptionally tough, structural bonds, delivering outstanding shear, peel, and impact strength for long-lasting performance.
• Crucially, when underfilling CSP and BGA chips, this resin effectively buffers expansion/contraction stress on solder ball contacts and absorbs shear forces during drop tests.

Key Features

• Solvent-free, non-volatile system for enhanced safety.
• Low viscosity with exceptional fluidity, simplifying application.
• Hardened surface maintains excellent gloss without oiliness.
• Optimized reactivity at temperatures exceeding 150°C.
• Outstanding resistance to rebound, fatigue, and cracking.
• Compliant with 2011/65/EU RoHS regulations.
• Halogen-free, meeting strict environmental standards (Cl < 900ppm, Br < 900ppm, Cl+Br < 1500ppm).