Everwide Chemical JC 823-6 Epoxy for BGA, CSP Under-fill

Product Description

• This specialized one-component epoxy, from Everwide Chemical, functions as a highly effective and reworkable adhesive for various electronic device bonding applications.
• Engineered for fast curing at elevated temperatures, this resin significantly reduces working time while simultaneously boosting production efficiency.
• It forms exceptionally tough, strong, and structural bonds, delivering outstanding shear, peel, and impact strength for long-lasting reliability.
• When utilized for BGA and CSP chip underfilling, it adeptly buffers expansion/contraction stresses on solder ball contacts and mitigates shear forces during drop tests.
• Its remarkable durability ensures robust performance, consistently passing a wide array of stringent environmental test experiments.

Key Features

• Completely solvent-free with no volatile organic compounds released during application.
• Exhibits low viscosity and excellent fluidity, ensuring superb flow and coverage.
• The cured surface presents a desirable non-oily finish with excellent gloss.
• Demonstrates good reactivity when exposed to temperatures exceeding 150 °C.
• Offers superior rebound, fatigue, and crack resistance, crucial for demanding applications.
• Fully complies with the 2011/65/EU RoHS regulations for hazardous substances.
• Meets stringent halogen-free requirements, with chlorine < 900ppm and bromine < 900ppm (Cl+Br < 1500ppm).