Everwide JC 823-3 Epoxy for BGA, CSP Under-fill

Product Description

• A high-performance one-component epoxy adhesive from Everwide Chemical designed for rework processes and various electronic device applications, including casting and sealing.
• This advanced resin facilitates efficient manufacturing with its rapid high-temperature curing capability, significantly reducing operational time and boosting productivity.
• It forms exceptionally tough, strong, and structural bonds, delivering outstanding shear, peel, and impact strength for long-lasting durability in demanding environments.
• Specifically engineered for underfilling BGA and CSP chips, it effectively buffers expansion/contraction stress on solder ball contacts and mitigates shear forces during drop tests.
• The formulation is solvent-free, non-volatile, and adheres to 2011/65/EU RoHS regulations, ensuring environmental compliance and safe handling with no toxic volatilizations.

Key Features

• Solvent-free and non-volatile system
• Low viscosity with excellent fluidity for easy operation and casting
• Hardened surface free from oiliness and poor gloss
• Good reactivity at temperatures above 150°C
• Exhibits high rebound, fatigue, and crack resistance
• Complies with 2011/65/EU RoHS regulations
• Meets strict halogen content requirements (chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm)