This specialized one-component epoxy adhesive from Everwide Chemical is explicitly formulated for encapsulating electronic devices.
It provides exceptional adhesion strength, impressive resistance to grease, chemicals, and solvents, alongside a desirably low ion content.
Featuring unique rheological properties, this resin is perfectly suited for dependable dam and seal applications within electronics manufacturing.
Exhibiting very high levels of durability, this product successfully passes numerous environmental test experiments, ensuring robust and long-lasting performance.
Due to its outstanding characteristics and proven reliability, this high-performance adhesive sees wide utilization across various industrial sectors.
Key Features
Boasts high viscosity and excellent thixotropy, enabling controlled flow and superior sag resistance.
The cured surface consistently maintains a non-oily finish with good gloss.
Demonstrates excellent dimensional stability over a wide range of operating temperatures.
Provides high vibration resistance under ordinary temperature conditions.
Maintains excellent retained strength even after rigorous environmental test experiments.
The fully cured product offers effective protection against moisture and water ingress.
Fully complies with the stringent 2011/65/EU RoHS regulations.
Adheres to specific halogen content limits: Chlorine < 900ppm, Bromine < 900ppm, and combined Chlorine + Bromine < 1500ppm.
