This advanced Everwide Chemical FX 219G3 represents a high-performance, two-component addition-type silicone, meticulously formulated for potting and encapsulating sensitive electronic components.
Engineered with exceptional fluidity, this material ensures comprehensive penetration and complete encapsulation, effectively shielding delicate circuits from a myriad of environmental stressors.
It offers versatile curing options, achieving a soft, highly flexible, and non-brittle final product at room temperature or through accelerated heat, maintaining its integrity and performance over extended operational periods.
Boasting superior electrical insulation, remarkable environmental aging resistance, and robust thermal shock capabilities, this compound significantly enhances the durability and operational longevity of potted assemblies.
This sophisticated silicone compound adheres to stringent RoHS regulations and achieves a UL 94 V-0 fire resistance rating (at 1.5mm), emphatically underscoring its safety and reliability for diverse and critical industrial applications.
Key Features
Exhibits excellent leveling properties prior to curing.
Facilitates curing at ambient room temperature or can be accelerated with heat.
Features low curing volume shrinkage and emits no by-product gases.
Offers a wide operational temperature range after complete curing.
Provides superior thermal shock resistance, ensuring robust performance.
