An advanced photo-curing resin formulated by Everwide Chemical, specifically designed for meticulously filling gaps within diverse optical components.
This specialized adhesive provides excellent adhesion properties and robust resistance to thermal shock once fully cured, ensuring long-term reliability.
Initially cured and pre-fixed using UV light, the resin benefits from a subsequent heating and hardening process to achieve comprehensive and superior curing performance.
Known for its high viscosity, significant thixotropy, and low water vapor permeability, it ensures precise application and robust environmental protection for sensitive assemblies.
A solvent-free and low-pollution formulation, it meets 2011/65/EU RoHS regulations, making it a responsible choice for modern industrial applications like C-MOS.
Key Features
Rapid UV curing with enhanced post-bake hardening capabilities.
Exhibits exceptional adhesion to various substrates including glass, metal, and ITO.
Characterized by high viscosity and pronounced thixotropic properties for controlled application.
Achieves high hardness and maintains integrity under elevated temperatures after curing.
Features remarkably low water vapor permeability, enhancing component protection.
Provides robust resistance against moisture ingress post-curing.
Sustains high mechanical strength even after rigorous environmental acceleration tests.
A solvent-free and environmentally conscious, low-pollution resin formulation.
Fully compliant with the strict 2011/65/EU RoHS regulations.
