This specialized one-component silicone adhesive from Everwide Chemical Co., Ltd. is engineered for high-performance electronic applications.
Boasting exceptional thixotropy, this advanced sealant consistently resists slumping, ensuring precise application and uniform bond lines without dripping.
Designed for rapid heat curing, the product transforms into a moderately hard yet highly flexible material, adept at accommodating various stresses and movements.
It provides superior bonding strength to a wide range of substrates, including glass, ceramics, and metals, often without the need for a primer, making it ideal for FIPG and CIPG electronic assembly requirements.
Complying fully with 2011/65/EU RoHS regulations, this silicone underscores a commitment to environmental safety and adherence to strict material standards.
Key Features
No mixing process is required before application.
Formulated without toxic organic volatile compounds.
Exhibits stable mechanical and electrical properties across a broad temperature range.
Maintains excellent retained strength following extensive environmental exposure tests.
Offers robust resistance to both shrinkage and shear forces.
Provides superior weather resistance and non-yellowing characteristics for long-term aesthetic and functional integrity.
Achieves strong, reliable adhesion to glass, ceramics, and metals without the necessity of a primer.
Fully complies with 2011/65/EU RoHS regulations, ensuring responsible material usage.
