• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Manufacturer > Everwide > Epoxy for Optoelectronic Devices Potting and Bonding
Prostech Everwide JE085-2 One Component Epoxy Adhesive

Epoxy for Optoelectronic Devices Potting and Bonding

  • Product code: JB007-1
  • Manufacturer: Everwide
  • Package size:
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

JB007-1 is epoxy resin for optoelectronic devices. This resin has good operability, excellent surface gloss after curing, and good resistance to chemicals. Due to its rapid cured at low temperature, this product has two characteristics of application method and rapid cured. It is a widely used epoxy resin. 

Key Features 

  • The hardener of this product which is exposure in air will not yield an insoluble, whitish solid.
  • It offers excellent retention of electrical insulation properties under high humidity conditions.
  • The resin cures rapidly at room temperature.
  • The hardening surface will not exhibit poor gloss.
  • This product complies with the 2011/65/EU RoHS regulations.

Applications

This product can be applied to infusion of metal and plastic. This resin can completely seal the electronic parts in the insulating container. This product has excellent durability and can pass many different environmental tests.

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    2k potting system
    Gluditec Bubble-Free 2K Potting Systems
    https://prostech.vn/gluditec-bubble-free-2k-potting-systems/

    1. Introduction of Gluditec Bubble-Free 2K Potting Systems2. Key Features of Gluditec Bubble-Free 2K Potting Systems3. Industrial Applications of Gluditec

    battery modules in EV manufacturing,
    Conquer the Pump-Out Effect with Advanced TIMs
    https://prostech.vn/conquer-the-pump-out-effect-with-advanced-tims/

    1. The Mechanics: What Causes the Pump-Out Effect in EV Manufacturing?2. The Impact: How Thermal Failure Shortens the Battery Life

    railway manufacturing
    Low Pressure Molding (LPM) vs. Potting for PCB Protection in Railway
    https://prostech.vn/potting-lpm-pcb-protection-railway/

    1. Operating Environment and Regulatory Context in the Rail Industry2. Potting for PCB Protection in Railway3. Low Pressure Molding (LPM)

    Everwide Chemical Co. GE4245 Silicone System Thermal Gel
    Everwide Chemical Co. GE4245 Silicone System Thermal Gel
    https://prostech.vn/everwide-chemical-co-ge4245-silicone-system-thermal-gel/

    Product DescriptionKey Features Product Description This is a highly viscous, solvent-free reactive silicone system thermal paste developed by Everwide Chemical

    Similar Products

    • ITW Polymers & Fluids

      Devcon EP8100HF Transparent Epoxy Potting Compound

      See details
    • Prostech GLT-132BL89-Tin-free, moisture curing, modified silicone adhesive

      GLT595-26 Fast-setting Epoxy for Bonding

      See details
    • GLT A595-2

      GLT A595-2 Fast-setting Epoxy for Bonding

      See details
    • Everwide JTW4103 Moisture Curing Modified Silicone Adhesive Prostech Vietnam

      Everwide JTW4103 Moisture Curing Modified Silicone Adhesive

      See details
    Epoxy for Optoelectronic Devices Potting and Bonding

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Epoxy for Optoelectronic Devices Potting and Bonding

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Epoxy for Optoelectronic Devices Potting and Bonding

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Epoxy for Optoelectronic Devices Potting and Bonding

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!