This highly specialized, two-component epoxy adhesive, developed by EPO-TEK, is engineered to provide superior performance in demanding applications.
It exhibits distinct thixotropic and non-flowing characteristics, ensuring precise application without spreading, crucial for intricate assemblies.
Offering exceptional high-temperature resistance, this epoxy can endure sustained temperatures up to 300°C, making it suitable for hybrid circuit environments.
Versatile in its utility, it securely bonds a wide array of materials including metals, glass, ceramics, and various plastics, perfect for fiber optic and circuit board applications.
Application flexibility is a key advantage, supporting methods from screen printing and spatula use to advanced manual or automatic dispensing systems.
Key Features
Two-component system for robust bonding
Highly thixotropic, non-flowing paste consistency
Exceptional high-temperature resistance for sustained use
Glass Transition Temperature (Tg) of ≥ 90 °C
High Shore D Hardness rating of 80
Minimal weight loss even at elevated temperatures
Excellent volume resistivity for electrical insulation
Visual amber color change upon proper curing for easy inspection
Suitable for fiber optic and circuit assembly applications.
Recommended for bonding metals, glass, ceramics and many types of plastic.
High temperature adhesive for hybrids; it can resist within the 300°C range for long periods of time.
Circuit assembly applications; staking SMD’s to PCB, bonding ferrite cores together in copper coil windings, inductor coils and power devices; suitable for COB glob top DAM material.
Alternative product versions available with distinct viscosity ranges – contact Technical Services at techserv@epotek.com for best recommendation. o For an ISO 10993 biocompatible version, see EPO-TEK ® MED-353ND-T.
Can be applied by screen printing, spatula, hand held or automatic dispensing equipment.
Amber color change when properly cured for easy visual ID and inspection.
