Eco-Stencil™ RF is an effective non-flammable drop-in replacement for isopropyl alcohol (IPA) and other solvents commonly used in rinse-free batch stencil-cleaning systems. Designed for ultrasonic and spray-in-air systems, Eco-Stencil™ RF batch stencil cleaner offers great cleaning performance with much lower environmental impact. Unique solvent and DI water blend is effective at removing a wide variety of solder paste (e.g. water-based, RMA, no-clean, lead-free) and uncured adhesives from stencils and misprinted boards. Higher concentration can be used for more difficult pastes and adhesives.
Eco-Stencil™ RF can be used in all the most popular cleaning equipment: Aqueous Technologies, Austin America Technologies, Smart Sonic, EMC Global, and more. Eco-Stencil™ RF works with current filtration methods, providing a long bath life and minimized disposal cost.
Eco-Stencil™ RF batch stencil cleaner has been tested and proven compatible with every part of your stencil from the frame, screen and stencil to the adhesives binding it together.
Features / Benefits
• Rinse-free, drop-in replacement for IPA
• Quickly clean paste or uncured adhesive
• Effective on all solder pastes: lead, lead-free, aqueous, RMA & no-clean
• Safe for stencils, misprinted boards & cleaning equipment
• Biodegradable
• Nonflammable
• Lower VOC compare to IPA, zero GWP
• Non-ozone depleting
• Halide-free — prevents ionic contamination
EXPOSURE LIMIT
Limits on components not established.
Manufacturer’s recommendation 1000 ppm.
