BERGQUIST® GAP PAD® TGP HC3000

BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.

FEATURES:

• Thermal conductivity: 3.0 W/m-K
• High-compliance, low compression stress
• Fiberglass-reinforced for shear and tear resistance

APPLICATIONS:

• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks