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BERGQUIST® GAP PAD® TGP HC3000 Prostech Vietnam

BERGQUIST® GAP PAD® TGP HC3000

  • Product code: TGP HC3000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.

FEATURES:

  • Thermal conductivity: 3.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass-reinforced for shear and tear resistance

APPLICATIONS:

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sinks

 

PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Blue Blue Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.020 to 0.125   0.508 to 3.175  ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 3.1 3.1 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 15 15 ASTM D2240
Young’s Modulus (psi) / (kPa) 16  110 ASTM D575
Continuous Use Temp. (°F) / (°C) 76 to 392  -60 to 200 —
Dielectric Breakdown Voltage (VAC) > 5,000 > 5,000 ASTM D149
Dielectric Constant (1,000 Hz) 6.5 6.5 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470

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