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BERGQUIST® GAP PAD® TGP 800VO Prostech Vietnam

BERGQUIST® GAP PAD® TGP 800VO

  • Product code: TGP 800VO
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months
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BERGQUIST GAP PAD TGP 800VO (Highly Conformable, Thermally Conductive Material for Filling Air Gaps) is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST® GAP PAD® TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

FEATURES:

  • Thermal conductivity: 0.8 W/m-K
  • Enhanced puncture, shear and tear resistance
  • Conformable gap filling material
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Between heat-generating semiconductors and a heat sink
  • Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Between heat-generating magnetic components and a heat sink

 

ColorGold/PinkGold/PinkVisual
Reinforcement CarrierFiberglassFiberglass—
Thickness (in.) / (mm)0.020 to 0.2500.508 to 6.350ASTM D374
Inherent Surface Tack (1-sided)11—
Density, Bulk, Rubber (g/cc)1.61.6ASTM D792
Heat Capacity ( J/g-K)1.01.0ASTM E1269
Hardness, Bulk Rubber (Shore 00)4040ASTM D2240
Young’s Modulus (psi) / (kPa)100689ASTM D575
Continuous Use Temp. (°F) / (°C)-76 to 392-60 to 200—
Dielectric Breakdown Voltage (VAC)> 6,000> 6,000ASTM D149
Dielectric Constant (1,000 Hz)5.55.5ASTM D150
Volume Resistivity (Ω-m)10111011ASTM D257
Flame RatingV-OV-OUL 94
Thermal Conductivity (W/m-K)0.80.8ASTM D5470

 

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